Patent Assignment
Reel/Frame 016701/0911
Assignment of Assignor's Interest
Recorded: 2005-06-10
Pages: 3
Assignors
YIM, KANG SUB
Executed: 2005-06-09
HUANG, LIHUA LI
Executed: 2005-06-09
SCHMITT, FRANCIMAR
Executed: 2005-06-09
XIA, LI-QUN
Executed: 2005-06-08
Assignee
APPLIED MATERIALS, INC.
LEGAL AFFAIRS DEPARTMENT, P.O. BOX 450A, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Low Temperature Process to Produce Low-K Dielectrics with Low Stress by Plasma-Enhanced Chemical Vapor Deposition (Pecvd)