Patent Assignment
Reel/Frame 016702/0379
Assignment of Assignor's Interest
Recorded: 2005-10-28
Pages: 4
Assignors
EMMERT, JAMES R
Executed: 2005-09-21
EVANS, CHARLES
Executed: 2005-09-21
RENCHER, MICHAEL A
Executed: 2005-09-21
DUAN, HAORAN
Executed: 2005-09-21
Assignee
AGILENT TECHNOLOGIES, INC.
P.O.BOX 7599, LEGAL DEPARTMENT, MS DL429, LOVELAND, COLORADO, 80537-0599
Covered Property
(1)
Modular Bonding Pad Structure and Method
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
Assignment of Assignor's Interest
May 20, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: III HOLDINGS 1, LLC
Reel/Frame 032932/0719 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →