Patent Assignment
Reel/Frame 032932/0719
Assignment of Assignor's Interest
Recorded: 2014-05-20
Pages: 9
Assignor
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Executed: 2014-02-13
Assignee
III HOLDINGS 1, LLC
2711 CENTERVILLE RD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties
(26)
Solder Retention Ring for Improved Solder Bump Formation
Patent:
6,085,968 →
Application:
09/235,579 →
Demountable Heat Spreader and High Reliability Flip Chip Package Assembly
Patent:
6,191,478 →
Application:
09/326,339 →
Low-Stress Interface Between Materials Having Different Thermal Coefficients of Expansion and Method for Fabricating Same
Patent:
6,238,805 →
Application:
09/415,286 →
Multimodal Optimization Technique in Test Generation
Patent:
6,810,372 →
Application:
09/456,953 →
Method for Delay Line Linearity Testing
Patent:
6,437,553 →
Application:
09/675,918 →
High Density Contact Arrangement
Patent:
6,556,454 →
Application:
09/702,481 →
Systems and Methods for Facilitating Testing of Pad Receivers of Integrated Circuits
Patent:
6,577,980 →
Application:
09/723,831 →
Apparatus and Method for Handling an Integrated Circuit
Systems and Methods for Facilitating Driver Strength Testing of Integrated Circuits
System and Method for Testing Integrated Circuits by Transient Signal Analysis
Apparatus and Method for Controlling Movement of a Device After Packaging
Semiconductor Chip Package with a Package Substrate and a Lid Cover
Systems and Methods for Testing Integrated Circuits
Patent:
6,707,313 →
Application:
10/369,069 →
Systems and Methods for Facilitating Testing of Pad Receivers of Integrated Circuits
High Speed Channel Selector Switch
Via Placement for Layer Transitions in Flexible Circuits with High Density Ball Grid Arrays
Heat Transfer Apparatus and Method of Manufacturing an Integrated Circuit and Heat Sink Assembly
Systems and Methods for Testing Receiver Terminations in Integrated Circuits
Thermal Dissipation in Integrated Circuit Systems
Quad Flat Pack (Qfp) Package and Flexible Power Distribution Method Therefor
Modular Bonding Pad Structure and Method
Apparatus and Method for Providing Bypass Capacitance and Power Routing in Qfp Package
System and Method for Implementing Package Level Ip Preverification for System on Chip Devices
Thermally Enhanced Package for an Integrated Circuit
Electronic Device Having a Dimensionally-Stable Electrically-Conductive Flexible Substrate
Modular Bonding Pad Structure and Method
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 10, 2004
From: ROSENAU, STEVEN; ALI, MOHAMMED ERSHAD; SIMON, JONATHAN; LEMOFF, BRIAN
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 014326/0354 →
Assignment of Assignor's Interest
Apr 5, 2004
From: ROHRBAUGH, JOHN; REARICK, JEFFREY
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 014490/0041 →
Assignment of Assignor's Interest
Aug 19, 2004
From: KELLY, MICHAEL G.
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 015075/0082 →
Assignment of Assignor's Interest
Oct 8, 2004
From: HEWLETT-PACKARD COMPANY
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 015232/0278 →
Clarification to Patent and Patent Application Assignment
Mar 31, 2005
From: HEWLETT-PACKARD COMPANY; AGILENT TECHNOLOGIES INC.; HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT-PACKARD COMPANY; HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; AGILENT TECHNOLOGIES, INC.
Reel/Frame 015980/0930 →
Assignment of Assignor's Interest
Feb 8, 2006
From: WHELESS, JR., THOMAS O; BRIGGS, RANDALL DON; CUSACK, MICHAEL D
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 017141/0510 →
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017207/0020 →
Security Agreement
Feb 24, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: CITICORP NORTH AMERICA, INC.
Reel/Frame 017207/0882 →
Assignment of Assignor's Interest
Mar 30, 2007
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 019084/0508 →
Release of Security Interest
May 15, 2013
From: CITICORP NORTH AMERICA, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030420/0375 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 017207 Frame 0020. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →