Granted Patent
Utility
US 6,191,478 · App. 09/326,339
Demountable heat spreader and high reliability flip chip package assembly
Inventor:
Kim Hong Chen
Patented Case
View Patent ↗
Granted: Feb 20, 2001
Filed: Jun 7, 1999
Inventor
Kim Hong Chen
Assignee (at issue)
Agilent Technologies, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.