IP Library › Assignment 016704/0570
Patent Assignment
Reel/Frame 016704/0570

Assignment of Assignor's Interest

Recorded: 2005-09-01 Pages: 2
Assignors
NISHINO, SHIGEHIRO
Executed: 2005-07-06
MURATA, KAZUTOSHI
Executed: 2005-07-13
Assignee
MITSUI ENGINEERING & SHIPBUILDING CO, LTD.
6-4, TSUKIJI 5-CHOME, CHUO-KU, TOKYO 104-8439, JAPAN
Covered Property (1)
Large-Diameter Sic Wafer and Manufacturing Method Thereof
Patent: 7,544,249 →
Application: 10/520,141 →
Publication: US 2006/0097266
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name and Company Split Jul 23, 2018
From: MITSUI ENGINEERING & SHIPBUILDING CO., LTD.
To: MITSUI E&S MACHINERY CO., LTD.
Reel/Frame 046609/0255 →
Assignment of Assignor's Interest Sep 13, 2019
From: MITSUI E&S MACHINERY CO., LTD.
To: FERROTEC HOLDINGS CORPORATION
Reel/Frame 050370/0773 →
Corrective Assignment to Correct the Assignee Address Previously Recorded at Reel: 050370 Frame: 0773. Assignor(S) Hereby Confirms the Assignment. Sep 19, 2019
From: MITSUI E&S MACHINERY CO., LTD.
To: FERROTEC HOLDINGS CORPORATION
Reel/Frame 050441/0158 →