IP Library › Assignment 016711/0145
Patent Assignment
Reel/Frame 016711/0145

Assignment of Assignor's Interest

Recorded: 2005-06-21 Pages: 2
Assignors
MORISAWA, TOSHIHIRO
Executed: 2005-05-13
ABE, HISAHIKO
Executed: 2005-05-12
TACHIKAWA, KOSAKU
Executed: 2005-05-12
NAKAJIMA, TOSHIHIRO
Executed: 2005-05-16
Assignee
HITACHI, LTD.
6-6, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property (1)
Method of Polishing Semiconductor Wafer
Patent: 7,070,477 →
Application: 11/117,294 →
Publication: US 2005/0245169
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 1, 2008
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 020892/0462 →
Merger and Change of Name Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024964/0180 →