Patent Assignment
Reel/Frame 020892/0462
Assignment of Assignor's Interest
Recorded: 2008-05-01
Pages: 2
Assignor
HITACHI, LTD.
Executed: 2007-02-22
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Polishing Semiconductor Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 21, 2005
From: MORISAWA, TOSHIHIRO; ABE, HISAHIKO; TACHIKAWA, KOSAKU; NAKAJIMA, TOSHIHIRO
To: HITACHI, LTD.
Reel/Frame 016711/0145 →
Merger and Change of Name
Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024964/0180 →