IP Library › Assignment 016712/0510
Patent Assignment
Reel/Frame 016712/0510

Assignment of Assignor's Interest

Recorded: 2005-09-02 Pages: 7
Assignor
ASM AMERICA, INC.
Executed: 2004-01-14
Assignees
INTERUNIVERSITAIR MICROELECTRONICA CENTRUM VZW (IMEC)
KAPELDREEF 75, 3001, LEUVEN, BELGIUM
ASM INTERNATIONAL NV
JAN VAO EYCKLAAN 10, 3723BC, BILTHOVEN, NETHERLANDS
Covered Properties (3)
Method for Bottomless Deposition of Barrier Layers in Integrated Circuit Metallization Schemes
Patent: 6,391,785 →
Application: 09/644,636 →
Method for Bottomless Deposition of Barrier Layers in Integrated Circuit Metallization Schemes
Patent: 6,664,192 →
Application: 10/123,492 →
Publication: US 2002/0155722
Method for Bottomless Deposition of Barrier Layers in Integrated Circuit Metallization Schemes
Patent: 6,852,635 →
Application: 10/731,656 →
Publication: US 2004/0121616
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 26, 2000
From: SATTA, ALESSANDRA; MAEX, KAREN; ELERS, KAI-ERIK; SAANILA, VILLE ANTERO
To: ASM AMERICA, INC.
Reel/Frame 011397/0805 →
Assignment of Assignor's Interest Jan 20, 2004
From: ASM AMERICA, INC.
To: INTERUNIVERSITAIR MICROELECTRONICA CENTRUM VZW; ASM INTERNATIONAL NV
Reel/Frame 014902/0396 →