Patent Assignment
Reel/Frame 016715/0623
Assignment of Assignor's Interest
Recorded: 2005-06-21
Pages: 3
Assignors
OH, HYEOK-SANG
Executed: 2005-06-08
CHUNG, JU-HYUCK
Executed: 2005-06-08
KIM, IL-GOO
Executed: 2005-06-08
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONNGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Fabricating Dual Damascene Interconnection