Patent Assignment
Reel/Frame 016715/0927
Assignment of Assignor's Interest
Recorded: 2005-11-01
Pages: 4
Assignors
MERASSI, ANGELO
Executed: 2005-10-06
MURARI, BRUNO
Executed: 2005-10-06
ZERBINI, SARAH
Executed: 2005-10-06
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, AGRATE BRIANZA, 20041, ITALY
Covered Property
(1)
Micro-Electromechanical Structure with Improved Insensitivity to Thermomechanical Stresses Induced by the Package