Patent Assignment
Reel/Frame 016729/0324
Assignment of Assignor's Interest
Recorded: 2005-06-22
Pages: 5
Assignors
HECK, JOHN
Executed: 2005-06-02
MA, QING
Executed: 2005-06-02
TRAN, QUAN
Executed: 2005-06-02
CHOU, TSUNG-KUAN ALLEN
Executed: 2005-06-03
ALTSHULER, SEMEON
Executed: 2005-06-06
WEINFELD, BOAZ
Executed: 2005-06-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Through-Wafer Vias and Surface Metallization for Coupling Thereto