Patent Assignment
Reel/Frame 016736/0135
Assignment of Assignor's Interest
Recorded: 2005-06-29
Pages: 3
Assignors
ASAI, MOTOO
Executed: 2004-11-05
KODAMA, HIROAKI
Executed: 2004-11-05
TANAKA, TOYOAKI
Executed: 2004-11-05
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU 503-8004, JAPAN
Covered Property
(1)
Substrate for Mounting Ic Chip