IP Library Assignment 016744/0402
Patent Assignment
Reel/Frame 016744/0402

Assignment of Assignor's Interest

Recorded: 2005-09-07 Pages: 3
Assignors
CHEN, CHIEN-HUA
Executed: 2005-07-29
BAMBER, JOHN
Executed: 2005-07-29
KANG, HENRY
Executed: 2005-07-29
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
Micro Electro-Mechanical System Packaging and Interconnect
Patent: 8,217,473 →
Application: 11/192,945 →
Publication: US 2007/0128828