IP Library Assignment 016751/0888
Patent Assignment
Reel/Frame 016751/0888

Assignment of Assignor's Interest

Recorded: 2005-07-05 Pages: 2
Assignors
MIYAZAKI, TAKASHI
Executed: 2005-06-24
FUNAYA, TAKUO
Executed: 2005-06-24
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO 108-8001, JAPAN
Covered Property (1)
Semiconductor Device, Semiconductor Device Module and Method of Manufacturing the Semiconductor Device
Patent: 7,692,297 →
Application: 11/172,783 →
Publication: US 2006/0012038
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0868 →