Patent Assignment
Reel/Frame 016751/0952
Assignment of Assignor's Interest
Recorded: 2005-07-14
Pages: 3
Assignor
MURAYAMA, KEI
Executed: 2005-07-08
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADAMACHI, NAGANO-SHI, NAGANO 381-2287, JAPAN
Covered Property
(1)
Substrate, Semiconductor Device, Method of Manufacturing Substrate, and Method of Manufacturing Semiconductor Device