Patent Assignment
Reel/Frame 016759/0155
Assignment of Assignor's Interest
Recorded: 2005-07-06
Pages: 2
Assignors
TOYODA, OSAMU
Executed: 2004-10-26
INOUE, KAZUNORI
Executed: 2004-10-22
TOKAI, AKIRA
Executed: 2004-10-21
Assignees
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
ADVANCED PDP DEVELOPMENT CENTER CORPORATION
1-20-10, SEKIGUCHI, BUNKYO-KU, TOKYO 112-0014, JAPAN
Covered Property
(1)
Molding Material Transfer Method and Substrate Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Trust Agreement Regarding Patent Rights, Etc. Dated July 27, 2005 and Memorandum of Understanding Regarding Trust Dated March 28, 2007
Apr 13, 2007
From: HITACHI LTD.
To: HITACHI PLASMA PATENT LICENSING CO., LTD.
Reel/Frame 019147/0847 →
Assignment of Assignor's Interest
Apr 22, 2008
From: FUJITSU LIMITED
To: HITACHI, LTD.
Reel/Frame 020840/0056 →