Molding material transfer method and substrate structure
View Patent ↗The present invention provides a new and highly reliable substrate manufacturing technology for manufacturing a substrate with a protrusion pattern, which can decrease structural defects caused by involving bubbles when the protrusion pattern is formed, can improve the reliability of the product and the yield of the product, does not require off-line steps such as vacuum deaeration, and therefore improves the production efficiency and simplifies the steps. According to the present invention, a molding material paste is filled into the concave portions of an intaglio plate for filling, an intaglio plate for transfer on which a specific groove pattern is formed is partially contacted with the intaglio plate for filling, the molding material is filled into the grooves of the intaglio plate for transfer, then the molding material is transferred from the intaglio plate for transfer to a substrate as a protrusion pattern.
1. A molding material transfer method comprising:
filling a molding material in a form of a paste into concave portions in a flat face of a first intaglio plate;
partially contacting a second intaglio plate on which a specific pattern of grooves is formed, to the face of said first intaglio plate, and transferring, in this contacting status, the molding material in the concave portions of said first intaglio plate into the grooves of said second intaglio plate by capillary phenomenon; and
transferring the molding material in the grooves of said second intaglio plate onto a substrate to receive the transferred material as protrusions.
2. The molding material transfer method according to claim 1 , further comprising applying a material with a desired thickness onto the surface of said second intaglio plate after transferring the molding material from the concave portions of said first intaglio plate into the grooves of said second intaglio plate.
3. The molding material transfer method according to claim 1 , wherein a pattern of the concave portions of said first intaglio plate and the pattern of the grooves of said second intaglio plate have a positional relationship corresponding to each other.
4. The molding material transfer method according to claim 1 , wherein a depth of the concave portions of said first intaglio plate is shallower than a depth of the grooves of said second intaglio plate, and an opening area of the concave portion of said first intaglio plate is wider than an opening area of a groove of said second intaglio plate.
5. The molding material transfer method according to claim 1 , wherein the concave portions of said first intaglio plate are a plurality of dots, and said plurality of dots of the first intaglio plate and the pattern of the grooves of said second intaglio plate have a positional relationship corresponding to each other.
6. The molding material transfer method according to claim 1 , wherein said first intaglio plate is in the shape of a plane or cylindrical plane, and said second intaglio plate is in the shape of a cylindrical plane or is bendable.
7. A substrate structure for a plasma display panel, manufactured by a manufacturing method including the transfer method according to claim 1 , wherein said protrusions are ribs to partition a discharge space.
8. A molding material transfer method comprising:
filling a molding material paste into concave portions in a face of a first plate;
partially contacting a second plate having grooves to the face of said first plate;
transferring the molding material from the first plate to the grooves of the second plate by a capillary phenomenon; and
transferring the transferred molding material from the grooves of the second plate onto a substrate as protrusions.
9. A molding material transfer method for manufacturing of a substrate for a plasma display panel comprising:
filling a molding material in a form of a paste into concave portions in a flat face of a first intaglio plate;
partially contacting a second intaglio plate on which a specific pattern of grooves is formed to the face of said first intaglio plate, and transferring, in this contacting status, the molding material in the concave portions of the first intaglio plate into the grooves of said second intaglio plate by a capillary phenomenon, wherein a pattern of the concave portions of the first intaglio plate and a pattern of the grooves of the second intaglio plate have a positional relationship correspond to each other; and
transferring the molding material in the grooves of said second intaglio plate onto the substrate so as to form a barrier rib having a pattern corresponding to the specific pattern of the grooves.
10. The molding material transfer method according to claim 9 , further comprising applying an additional material with a desired thickness onto the surface of said second intaglio plate after transferring the molding material in the concave portions of said first intaglio plate into the grooves of said second intaglio plate, and transferring the additional material and the molding material from the second intaglio plate onto the substrate.