Patent Assignment
Reel/Frame 016795/0900
Assignment of Assignor's Interest
Recorded: 2005-11-18
Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2002-01-18
LIN, MOU-SHIUNG
Executed: 2002-01-18
HUANG, CHING-CHENG
Executed: 2002-01-18
Assignee
MEGIC CORPORATION
21, R&D 1ST. RD., SCIENCE-BASED INDUSTRIAL PARK HSINCHU, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Method for Fabricating Chip Package with Die and Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 11, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017600/0649 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →