Patent Assignment
Reel/Frame 016807/0668
Assignment of Assignor's Interest
Recorded: 2005-11-22
Pages: 2
Assignee
THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY
OFFICE OF NAVAL RESEARCH, ONE LIBERTY CENTER, ARLINGTON, VIRGINIA, 22203
Covered Property
(1)
Wafer Bonding of Thinned Electronic Materials and Circuits to High Performance Substrate