Patent Assignment
Reel/Frame 016809/0567
Assignment of Assignor's Interest
Recorded: 2005-07-25
Pages: 2
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Semiconductor Chip-Embedded Substrate and Method of Manufacturing Same