Patent Assignment
Reel/Frame 016839/0218
Assignment of Assignor's Interest
Recorded: 2005-09-22
Pages: 3
Assignors
FJELSTAD, JOSEPH C.
Executed: 2005-03-20
GRUNDY, KEVIN P.
Executed: 2005-03-20
YASUMURA, GARY
Executed: 2005-09-20
Assignee
SILICON PIPE, INC.
992 SOUTH DE ANZA BLVD., SUITE 201, SAN JOSE, CALIFORNIA, 95129
Covered Property
(1)
Ic Package Structures Having Separate Circuit Interconnection Structures and Assemblies Constructed Thereof
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Foreclosure by Secure Note Holders
Aug 7, 2008
From: SILICON PIPE, INC.
To: SECURE NOTE HOLDERS: DAN ANDERSON, JOSEPH FJELSTAD, KEVIN GRUNDY, LAURANCE GRUNDY, MATT STEPOVICH
Reel/Frame 021380/0276 →
Assignment of Assignor's Interest
Oct 24, 2008
From: HOLDERS, SECURE NOTE; ANDERSON, DAN; FJELSTAD, JOE; GRUNDY, KEVIN
To: NOVIAS, LLC
Reel/Frame 021744/0512 →
Assignment of Assignor's Interest
Nov 18, 2008
From: NOVIAS LLC
To: INTERCONNECT PORTFOLIO, LLC
Reel/Frame 021861/0127 →
License
Mar 4, 2009
From: INTERCONNECT PORTFOLIO LLC
To: TECHNOLOGY PROPERTIES LIMITED LLC
Reel/Frame 022343/0351 →
Assignment of Assignor's Interest
Oct 7, 2010
From: TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0596 →
Assignment of Assignor's Interest
Oct 7, 2010
From: INTERCONNECT PORTFOLIO, LLC; INTELLASYS BEC LIMITED; TECHNOLOGY PROPERTIES LIMITED
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 025105/0634 →