Patent Assignment
Reel/Frame 016841/0155
Assignment of Assignor's Interest
Recorded: 2005-09-26
Pages: 5
Assignors
HABA, BELGACEM
Executed: 2005-09-06
BEROZ, MASUD
Executed: 2005-08-29
URBISH, GLENN
Executed: 2005-09-14
TUCKERMAN, DAVID B.
Executed: 2005-09-19
Assignee
TESSERA, INC.
3099 ORCHARD DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Structure and Method of Forming Capped Chips
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →