IP Library › Assignment 016842/0197
Patent Assignment
Reel/Frame 016842/0197

Assignment of Assignor's Interest

Recorded: 2005-09-27 Pages: 4
Assignors
HONG, DUK HO
Executed: 2005-08-30
LEE, KYONG WOO
Executed: 2005-08-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Methods of Forming Integrated Circuit Devices Having Metal Interconnect Layers Therein
Patent: 7,282,451 →
Application: 11/216,686 →
Publication: US 2007/0045123
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 24, 2006
From: NAUJOK, MARKUS; KNOEFLER, ROMAN
To: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Reel/Frame 017052/0661 →
Assignment of Assignor's Interest Feb 10, 2006
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 017151/0485 →