IP Library Assignment 017052/0661
Patent Assignment
Reel/Frame 017052/0661

Assignment of Assignor's Interest

Recorded: 2006-01-24 Pages: 4
Assignors
NAUJOK, MARKUS
Executed: 2005-08-30
KNOEFLER, ROMAN
Executed: 2005-08-30
Assignee
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
1730 NORTH FIRST STREET, SAN JOSE, CALIFORNIA, 95112
Covered Property (1)
Methods of Forming Integrated Circuit Devices Having Metal Interconnect Layers Therein
Patent: 7,282,451 →
Application: 11/216,686 →
Publication: US 2007/0045123
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 27, 2005
From: HONG, DUK HO; LEE, KYONG WOO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 016842/0197 →
Assignment of Assignor's Interest Feb 10, 2006
From: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
To: INFINEON TECHNOLOGIES AG
Reel/Frame 017151/0485 →