Patent Assignment
Reel/Frame 016866/0866
Joint Assignees
Recorded: 2005-10-11
Pages: 3
Assignors
KURITA, HIDEYUKI
Executed: 2005-10-05
WATANABE, MASAO
Executed: 2005-10-05
NAKAMURA, MASAYUKI
Executed: 2005-10-05
FUKUDA, MITSUHIRO
Executed: 2005-10-05
USUI, HIROYUKI
Executed: 2005-10-05
Assignees
SONY CORPORATION
7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO 141-0001, JAPAN
SONY CHEMICALS CORP.
GATE CITY OSAKI EAST TOWER 8F, 1-11-2, OSAKAI, SHINAGAWA-KU, TOKYO 141-0032, JAPAN
Covered Property
(1)
Process for Manufacturing Multilayer Flexible Wiring Boards
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.