Patent Assignment
Reel/Frame 016886/0895
Assignment of Assignor's Interest
Recorded: 2005-08-19
Pages: 2
Assignors
TSAI, MING-HUAN
Executed: 2005-08-18
CHEN, FANG-CHENG
Executed: 2005-08-18
CHEN, CHAO-CHENG
Executed: 2005-08-18
JANG, SYUN-MING
Executed: 2005-08-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, ROC 300-77, TAIWAN
Covered Property
(1)
Contact or via Hole Structure with Enlarged Bottom Critical Dimension