Patent Assignment
Reel/Frame 016913/0157
Assignment of Assignor's Interest
Recorded: 2005-12-19
Pages: 3
Assignor
LU, SU-TSAI
Executed: 2005-12-15
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SECTION 4, CHUNG HSING ROAD, CHUTUNG, HSINCHU, TAIWAN
Covered Property
(1)
Chip Structure and Chip Package Structure