Assignment of Assignor's Interest

Recorded: 2005-12-20 Pages: 3

Assignor

YOUN, HAN-SHIN

Executed: 2005-11-07

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416 MAETAN-DONG YEONTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Covered Property (1)

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Application: 11/270,431 →

Publication: US 2006/0097377

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.