IP Library Assignment 016940/0899
Patent Assignment
Reel/Frame 016940/0899

Assignment of Assignor's Interest

Recorded: 2005-08-26 Pages: 4
Assignors
BAYLIS, WILLIAM H.
Executed: 2005-08-18
TYLER, JOHN E.
Executed: 2005-08-18
Assignee
DYNATEX INTERNATIONAL, A CALIFORNIA CORPORATION
5577 SKYLANE BOULEVARD, SANTA ROSA, CALIFORNIA, 95403
Covered Property (1)
Method and Apparatus for Breaking Semiconductor Wafers
Patent: 7,262,115 →
Application: 11/213,015 →
Publication: US 2007/0048972
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2022
From: DYNATEX INTERNATIONAL
To: CORNING INCORPORATED
Reel/Frame 060734/0942 →
Nunc Pro Tunc Assignment Jan 12, 2026
From: CORNING INCORPORATED
To: 4JET MICROTECH GMBH
Reel/Frame 073441/0215 →