Patent Assignment
Reel/Frame 060734/0942
Assignment of Assignor's Interest
Recorded: 2022-08-05
Pages: 3
Assignor
DYNATEX INTERNATIONAL
Executed: 2022-04-14
Assignee
CORNING INCORPORATED
SP-TI-3-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Method and Apparatus for Breaking Semiconductor Wafers
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.