Patent Assignment
Reel/Frame 016944/0330
Assignment of Assignor's Interest
Recorded: 2005-08-30
Pages: 4
Assignors
HAYASHI, AKIMORI
Executed: 2005-08-16
SUZUKI, KATSUNOBU
Executed: 2005-08-16
OIKAWA, RYUICHI
Executed: 2005-08-16
NAKAGOSHI, MAKOTO
Executed: 2005-08-16
SERA, NAOKO
Executed: 2005-08-16
MURAI, TADASHI
Executed: 2005-08-16
OGIHARA, CHIHO
Executed: 2005-08-16
KATAOKA, RYOHEL
Executed: 2005-08-16
KONDO, KOJI
Executed: 2005-08-16
YOKOCHI, TOMOHIRO
Executed: 2005-08-16
Assignees
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
DENSO CORPORATION
1-1, SHOWACHO, KARIYA-SHI, AICHI 448-8661, JAPAN
Covered Property
(1)
A Package Substrate for a Semiconductor Device Having Thermoplastic Resin Layers and Conductive Patterns
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.