Patent Assignment
Reel/Frame 016949/0493
Assignment of Assignor's Interest
Recorded: 2005-12-28
Pages: 3
Assignors
IM, YUN-HYEOK
Executed: 2005-09-01
YOO, JAE-WOOK
Executed: 2005-09-13
LEE, HEE-SEOK
Executed: 2005-09-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Having Coolant Path, Semiconductor Package and Package Cooling System Using the Same