Patent Assignment
Reel/Frame 016953/0349
Assignment of Assignor's Interest
Recorded: 2005-09-02
Pages: 3
Assignors
LEE, SEUNG HEE
Executed: 2005-08-19
PARK, DOO CHEOL
Executed: 2005-08-19
PARK, JOO HUN
Executed: 2005-08-19
LEE, YOUNG JIN
Executed: 2005-08-19
PARK, SANG WOOK
Executed: 2005-08-19
KIM, NAM HYEONG
Executed: 2005-08-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-GU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Type Surface Acoustic Wave Package, and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.