Patent Assignment
Reel/Frame 016954/0145
Assignment of Assignor's Interest
Recorded: 2005-09-02
Pages: 3
Assignor
KAO, CHING-HUNG
Executed: 2005-08-25
Assignee
UNITED MICROELECTRONICS CORP.
NO. 3, LI-HSIN RD. 11, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property
(1)
Interconnection Structure Used in a Pad Region of a Semiconductor Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.