Patent Assignment
Reel/Frame 016959/0868
Assignment of Assignor's Interest
Recorded: 2005-10-31
Pages: 4
Assignors
MATSUO, HIROYUKI
Executed: 2005-10-07
NAKAJIMA, TOSHIKI
Executed: 2005-10-04
MIYAZAKI, KUNIHIRO
Executed: 2005-10-24
Assignees
SEIKO EPSON CORPORATION
4-1 NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0811, JAPAN
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA, 1-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Etching Method, a Method of Forming a Trench Isolation Structure, a Semiconductor Substrate and a Semiconductor Apparatus