Patent Assignment
Reel/Frame 016964/0447
Assignment of Assignor's Interest
Recorded: 2006-01-04
Pages: 3
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Structure of Metal Interconnect and Fabrication Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.