Patent Assignment
Reel/Frame 065294/0055
Assignment of Assignor's Interest
Recorded: 2023-10-20
Pages: 7
Assignor
UNITED MICROELECTRONICS CORPORATION
Executed: 2023-10-13
Assignee
MARLIN SEMICONDUCTOR LIMITED
BLANCHARDSTOWN CORPORATE PARK 2, PLAZA 255, SUITE 2A, DUBLIN, D15 YH6H, IRELAND
Covered Properties
(15)
Interconnect Structure
Structure of Metal Interconnect and Fabrication Method Thereof
Fabricating Method of an Interconnect Structure
Method of Manufacturing Photomask and Method of Repairing Optical Proximity Correction
Structure of Metal Interconnect and Fabrication Method Thereof
Structure and Fabrication Method of Flash Memory
Method for Fabricating a Metal Gate Structure
Gate Structure and Method of Making the Same
Method of Manufacturing Photomask and Method of Repairing Optical Proximity Correction
Nonvolatile Memory Cell Comprising a Nanowire and Manufacturing Method Thereof
Method for Fabricating a Metal Gate Structure
Method of Manufacturing Photomask and Method of Repairing Optical Proximity Correction
Semiconductor Device and Fabrication Method Thereof
Non-Volatile Memory Which Can Increase the Operation Window
Semiconductor Device with Epitaxial Structure
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 18, 2005
From: HSU, YU-HAO; CHEN, MING-TSUNG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 016795/0897 →
Assignment of Assignor's Interest
Jan 4, 2006
From: CHOU, PEI-YU; HUANG, CHUN-JEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 016964/0447 →
Assignment of Assignor's Interest
Nov 13, 2006
From: LIN, LING-CHIEH; LEE, CHIEN-FU; HUANG, I-HSIUNG
To: UNITED MICROELECTONICS CORP.
Reel/Frame 018520/0613 →
Assignment of Assignor's Interest
May 14, 2007
From: CHOU, PEI-YU; HUANG, CHUN-JEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 019292/0350 →
Assignment of Assignor's Interest
Nov 14, 2007
From: LIN, SUNG-BIN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 020116/0036 →
Assignment of Assignor's Interest
Apr 11, 2008
From: LIN, CHIEN-TING; HSU, CHE-HUA; CHENG, LI-WEI
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 020786/0481 →
Assignment of Assignor's Interest
Jul 14, 2009
From: KAO, CHING-HUNG; HSU, CHIEN-EN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 022948/0845 →
Assignment of Assignor's Interest
Oct 5, 2009
From: HUERTA, ALMUDENA; VAN DUUREN, MICHIEL JOS; AKIL, NADER; GOLUBOVIC, DUSAN
To: NXP B.V.
Reel/Frame 023326/0159 →
Assignment of Assignor's Interest
Sep 27, 2010
From: LIN, CHIEN-TING; HSU, CHE-HUA; CHENG, LI-WEI
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 025043/0721 →
Assignment of Assignor's Interest
Jun 24, 2011
From: LIN, LING-CHIEH; LEE, CHIEN-FU; HUANG, I-HSIUNG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 026492/0866 →
Assignment of Assignor's Interest
Jun 9, 2013
From: HUNG, YU-HSIANG; FU, SSU-I; CHANG, CHUNG-FU; CHEN, CHENG-GUO
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 030573/0820 →
Assignment of Assignor's Interest
Mar 17, 2014
From: MOU, YA-NAN; LU, HSIN-PANG; CHEN, HSI-WEN
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 032449/0193 →
Assignment of Assignor's Interest
Feb 12, 2015
From: HUNG, YU-HSIANG; FU, SSU-I; CHANG, CHUNG-FU; CHEN, CHENG-GUO
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 034954/0176 →
Security Agreement Supplement
Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Assignment of Assignor's Interest
Mar 15, 2016
From: NXP B.V.
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 037973/0107 →
Certificate Re. Termination and Release of Security Interest in Patent Rights
Apr 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.; MIZUHO BANK, LTD.
To: NXP B.V.
Reel/Frame 038401/0296 →
Patent Release
Apr 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.; MIZUHO BANK, LTD.
To: NXP B.V.
Reel/Frame 038400/0637 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release
Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Release of Security Interest
Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042762 Frame 0145. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →