IP Library Assignment 038401/0296
Patent Assignment
Reel/Frame 038401/0296

Certificate Re. Termination and Release of Security Interest in Patent Rights

Recorded: 2016-04-11 Pages: 21
Assignors
MIZUHO BANK, LTD.
Executed: 2016-04-06
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, 5656 AG, EINDHOVEN, NETHERLANDS
Covered Properties (24)
Shallow Trench Isolation in Floating Gate Devices
Patent: 7,419,875 →
Application: 10/537,518 →
Publication: US 2006/0118861
Method of Detaching a Thin Semiconductor Circuit from Its Base
Patent: 8,338,228 →
Application: 11/574,014 →
Publication: US 2009/0215226
Reduction of Sheet Resistance of Phosphorus Implanted Poly-Silicon
Patent: 7,923,359 →
Application: 11/576,344 →
Publication: US 2011/0097883
Reduction of Cracking in Low-K Spin-on Dielectric Films
Patent: 7,670,961 →
Application: 11/629,058 →
Publication: US 2008/0026594
Method of Fabricating a Dual Gate Fet
Patent: 7,741,182 →
Application: 11/815,100 →
Publication: US 2008/0318375
Double Gate Non-Volatile Memory Device and Method of Manufacturing
Patent: 7,791,128 →
Application: 12/067,986 →
Publication: US 2008/0230824
Finfet-Based Non-Volatile Memory Device
Patent: 8,063,427 →
Application: 12/067,992 →
Publication: US 2008/0203462
Three-Dimensional Stacked Fin Mos Device with Multiple Gate Regions
Patent: 8,093,659 →
Application: 12/161,709 →
Publication: US 2010/0219479
Double-Gate Semiconductor Devices Having Gates with Different Work Functions and Methods of Manufacture Thereof
Patent: 7,791,140 →
Application: 12/278,629 →
Publication: US 2009/0242987
Seimiconductor Devices and Methods of Manufacture Thereof
Patent: 7,919,364 →
Application: 12/307,800 →
Publication: US 2009/0209092
Method for Improving Inversion Layer Mobility in a Silicon Carbide Mosfet
Patent: 8,012,818 →
Application: 12/439,584 →
Publication: US 2010/0006860
Resonator
Application: 12/444,684 →
Publication: US 2010/0090302
Double Patterning for Lithography to Increase Feature Spatial Density
Patent: 8,148,052 →
Application: 12/514,777 →
Publication: US 2010/0028809
Transistor Device and Method of Manufacturing Such a Transistor Device
Patent: 8,362,561 →
Application: 12/519,162 →
Publication: US 2010/0025766
Method for Manufacturing an Element Having Electrically Conductive Members for Application in a Microelectronic Package
Patent: 8,138,596 →
Application: 12/594,600 →
Publication: US 2010/0127385
Nonvolatile Memory Cell Comprising a Nanowire and Manufacturing Method Thereof
Patent: 8,546,863 →
Application: 12/594,673 →
Publication: US 2010/0117138
Electronic Device Comprising a Convertible Structure
Patent: 8,368,044 →
Application: 12/594,779 →
Publication: US 2010/0295010
Manufacturing Method for Planar Independent-Gate or Gate-All-Around Transistors
Patent: 7,923,315 →
Application: 12/809,876 →
Publication: US 2011/0014769
Finfet with Separate Gates and Method for Fabricating a Finfet with Separate Gates
Patent: 8,389,392 →
Application: 12/866,852 →
Publication: US 2010/0314684
Method for Manufacturing Semiconductor Device and Semiconductor Device
Application: 12/918,398 →
Publication: US 2011/0018065
Finfet Transistor with High-Voltage Capability and Cmos-Compatible Method for Fabricating the Same
Patent: 8,541,267 →
Application: 12/933,414 →
Publication: US 2011/0006369
Method of Making Bipolar Transistor
Patent: 7,939,416 →
Application: 12/935,924 →
Publication: US 2011/0034001
Gate Structure for Field Effect Transistor
Patent: 8,518,783 →
Application: 12/989,521 →
Publication: US 2011/0037131
Finfet Method and Device
Patent: 8,216,894 →
Application: 12/999,289 →
Publication: US 2011/0089493
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2005
From: SCHAIJK, ROBERTUS BAN; VAN DUUREN, MICHIEL
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 017449/0826 →
Assignment of Assignor's Interest Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest Mar 25, 2008
From: DOORNBOS, GERBEN; GOARIN, PIERRE
To: NXP B.V.
Reel/Frame 020696/0334 →
Assignment of Assignor's Interest Mar 27, 2008
From: GOARIN, PIERRE
To: NXP B.V.
Reel/Frame 020711/0231 →
Assignment of Assignor's Interest Jun 13, 2008
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 021085/0959 →
Assignment of Assignor's Interest Jun 18, 2008
From: VAN NOORT, WIBO DANIEL; WIDDERSHOVEN, FRANCISCUS PETRUS; SURDEANU, RADU
To: NXP B.V.
Reel/Frame 021115/0729 →
Assignment of Assignor's Interest Jul 22, 2008
From: NUTTINCK, SEBASTIEN
To: NXP B.V.
Reel/Frame 021270/0451 →
Assignment of Assignor's Interest Aug 7, 2008
From: VAN DAL, MARK; SURDEANU, RADU
To: NXP, B.V.
Reel/Frame 021356/0060 →
Assignment of Assignor's Interest Jan 7, 2009
From: SONSKY, JAN; DOORNBOS, GERBEN
To: NXP, B.V.
Reel/Frame 022068/0920 →
Assignment of Assignor's Interest Mar 2, 2009
From: ROEDLE, THOMAS C.; SVIENBJORNSSON, EINAR O.; ALLERSTAM, CARL F.; OLAFSSON, HALLDOR O.
To: NXP, B.V.
Reel/Frame 022330/0132 →
Assignment of Assignor's Interest Apr 7, 2009
From: NGUYEN HOANG, VIET; GRAVESTEIJN, DIRK; SURDEANU, RADU
To: NXP, B.V.
Reel/Frame 022516/0729 →
Assignment of Assignor's Interest Apr 8, 2009
From: GAKIS, ANDREAS; SCHNITT, WOLFGANG
To: NXP B.V.
Reel/Frame 022523/0717 →
Assignment of Assignor's Interest May 13, 2009
From: VANLEENHOVE, ANJA MONIQUE; VAN STEENWINCKEL, DAVID; VAN DAL, MARK; DOORNBOS, GERBEN
To: NXP, B.V.
Reel/Frame 022681/0121 →
Assignment of Assignor's Interest Jun 13, 2009
From: NUTTINCK, SEBASTIEN; CURATOLA, GILBERTO
To: NXP, B.V.
Reel/Frame 022822/0346 →
Assignment of Assignor's Interest Jul 24, 2009
From: EUEN, WOLFGANG; GROSS, STEPHAN
To: NXP, B.V.
Reel/Frame 023004/0796 →
Assignment of Assignor's Interest Oct 4, 2009
From: WEEKAMP, JOHANNES W.
To: NXP B.V.
Reel/Frame 023323/0247 →
Assignment of Assignor's Interest Oct 5, 2009
From: TIO CASTRO, DAVID; DELHOUGNE, ROMAIN
To: NXP B.V.
Reel/Frame 023327/0674 →
Assignment of Assignor's Interest Oct 5, 2009
From: HUERTA, ALMUDENA; VAN DUUREN, MICHIEL JOS; AKIL, NADER; GOLUBOVIC, DUSAN
To: NXP B.V.
Reel/Frame 023326/0159 →
Security Agreement Supplement Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Assignment of Assignor's Interest Mar 15, 2016
From: NXP B.V.
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 037973/0107 →
Patent Release Apr 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.; MIZUHO BANK, LTD.
To: NXP B.V.
Reel/Frame 038400/0637 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →