Patent Assignment
Reel/Frame 037973/0107
Assignment of Assignor's Interest
Recorded: 2016-03-15
Pages: 6
Assignor
NXP B.V.
Executed: 2015-10-04
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Properties
(34)
Method for Dry Etching Sidewall Polymer
Patent:
5,851,302 →
Application:
08/803,180 →
Self-Aligned Processing of Semiconductor Device Features
Patent:
6,074,921 →
Application:
08/886,170 →
Method for Forming via Contact Hole in a Semiconductor Device
Patent:
5,925,577 →
Application:
08/943,891 →
Integrated Etch Process for Polysilicon/Metal Gate
Patent:
6,060,376 →
Application:
09/005,244 →
Method of Minimizing Dishing During Chemical Mechanical Polishing of Semiconductor Metals for Making a Semiconductor Device
Patent:
6,093,656 →
Application:
09/031,169 →
Alternative Plasma Chemistry for Enhanced Photoresist Removal
Patent:
6,130,166 →
Application:
09/241,270 →
Method for Determining Nitrogen Concentration in a Film of Nitrided Oxide Material
Patent:
6,313,466 →
Application:
09/310,470 →
Method of Manufacturing a Semiconductor Device with Metallization Layers Interconnected by Tungsten Plugs
Semiconductor Device and Method of Manufacturing Such a Semiconductor Device
Shallow Trench Isolation in Floating Gate Devices
Method of Detaching a Thin Semiconductor Circuit from Its Base
Reduction of Sheet Resistance of Phosphorus Implanted Poly-Silicon
Reduction of Cracking in Low-K Spin-on Dielectric Films
Nanoscale Fet
Semiconductor Device Having Strip-Shaped Channel and Method for Manufacturing Such a Device
Method of Fabricating a Dual Gate Fet
Double Gate Non-Volatile Memory Device and Method of Manufacturing
Finfet-Based Non-Volatile Memory Device
Three-Dimensional Stacked Fin Mos Device with Multiple Gate Regions
Shallow Trench Isolation in Floating Gate Devices
Double-Gate Semiconductor Devices Having Gates with Different Work Functions and Methods of Manufacture Thereof
Seimiconductor Devices and Methods of Manufacture Thereof
Method for Improving Inversion Layer Mobility in a Silicon Carbide Mosfet
Double Patterning for Lithography to Increase Feature Spatial Density
Transistor Device and Method of Manufacturing Such a Transistor Device
Method for Manufacturing an Element Having Electrically Conductive Members for Application in a Microelectronic Package
Nonvolatile Memory Cell Comprising a Nanowire and Manufacturing Method Thereof
Electronic Device Comprising a Convertible Structure
Manufacturing Method for Planar Independent-Gate or Gate-All-Around Transistors
Finfet with Separate Gates and Method for Fabricating a Finfet with Separate Gates
Finfet Transistor with High-Voltage Capability and Cmos-Compatible Method for Fabricating the Same
Method of Making Bipolar Transistor
Gate Structure for Field Effect Transistor
Finfet Method and Device
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 19, 1997
From: SOLIS, RAMIRO
To: VLSI TECHNOLOGY, INC.
Reel/Frame 008448/0863 →
Assignment of Assignor's Interest
Oct 3, 1997
From: SOLIS, RAMIRO
To: VLSI TECHNOLOGY, INC.
Reel/Frame 008836/0720 →
Assignment of Assignor's Interest
Jan 12, 1998
From: GABRIEL, CALVIN; LIN, XI-WEI; ZHENG, TAMMY; LEARD, LINDA
To: VLSI TECHNOLOGY, INC.
Reel/Frame 008950/0264 →
Assignment of Assignor's Interest
Feb 26, 1998
From: LIN, XI-WEI
To: VLSI TECHNOLOGY, INC.
Reel/Frame 009018/0981 →
Assignment of Assignor's Interest
Apr 20, 1998
From: LIN, XI-WEI
To: VLSI TECHNOLOGY, INC.
Reel/Frame 009126/0798 →
Assignment of Assignor's Interest
Feb 1, 1999
From: YEH, EDWARD
To: VLSI TECHNOLOGY, INC.
Reel/Frame 009759/0297 →
Assignment of Assignor's Interest
May 12, 1999
From: OLSEN, CHRISTOPHER S.; BOTHRA, SUBHAS
To: VLSI TECHNOLOGY, INC.
Reel/Frame 009967/0197 →
Assignment of Assignor's Interest
Jun 19, 2002
From: VAN DE GOOR, ALBERTUS THEODORUS MARIA
To: KONIKLIJKE PHILIPS ELECTONICS N.V.
Reel/Frame 013014/0288 →
Assignment of Assignor's Interest
Jan 24, 2005
From: UNITED STATES PHILIPS CORPORATION
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 015618/0148 →
Assignment of Assignor's Interest
Jun 3, 2005
From: SCHAIJK, ROBERTUS BAN; VAN DUUREN, MICHIEL
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 017449/0826 →
Change of Name
Dec 15, 2006
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 018635/0570 →
Assignment of Assignor's Interest
Dec 15, 2006
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 018645/0779 →
Assignment of Assignor's Interest
Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
Change of Name
Dec 22, 2006
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 018668/0255 →
Assignment of Assignor's Interest
Jan 17, 2007
From: SURDEANU, RADU; AGARWAL, PRABHAT; BALKENENDE, ABRAHAM RUDOLF; BAKKERS, ERIK P., A., M.
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 018823/0821 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Assignment of Assignor's Interest
Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest
Mar 25, 2008
From: DOORNBOS, GERBEN; GOARIN, PIERRE
To: NXP B.V.
Reel/Frame 020696/0334 →
Assignment of Assignor's Interest
Mar 27, 2008
From: GOARIN, PIERRE
To: NXP B.V.
Reel/Frame 020711/0231 →
Assignment of Assignor's Interest
Jun 13, 2008
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 021085/0959 →
Assignment of Assignor's Interest
Jun 18, 2008
From: VAN NOORT, WIBO DANIEL; WIDDERSHOVEN, FRANCISCUS PETRUS; SURDEANU, RADU
To: NXP B.V.
Reel/Frame 021115/0729 →
Assignment of Assignor's Interest
Jul 22, 2008
From: NUTTINCK, SEBASTIEN
To: NXP B.V.
Reel/Frame 021270/0451 →
Confirmatory License
Oct 27, 2008
From: STATE UNIVERSITY OF NEW YORK AT BUFFALO
To: NATIONAL INSTITUTES OF HEALTH (NIH), U.S. DEPT. OF HEALTH AND HUMAN SERVICES (DHHS), U.S. GOVERNMENT
Reel/Frame 021743/0653 →
Assignment of Assignor's Interest
Apr 8, 2009
From: GAKIS, ANDREAS; SCHNITT, WOLFGANG
To: NXP B.V.
Reel/Frame 022523/0717 →
Assignment of Assignor's Interest
Jul 24, 2009
From: EUEN, WOLFGANG; GROSS, STEPHAN
To: NXP, B.V.
Reel/Frame 023004/0796 →