IP Library › Assignment 013014/0288
Patent Assignment
Reel/Frame 013014/0288

Assignment of Assignor's Interest

Recorded: 2002-06-19 Pages: 2
Assignor
Assignee
KONIKLIJKE PHILIPS ELECTONICS N.V.
GROENEWOUDSEWEG 1, 5621 BA EINDHOVEN, NETHERLANDS
Covered Property (1)
Method of Manufacturing a Semiconductor Device with Metallization Layers Interconnected by Tungsten Plugs
Patent: 6,555,470 →
Application: 10/101,329 →
Publication: US 2002/0155651
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
Assignment of Assignor's Interest Mar 15, 2016
From: NXP B.V.
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 037973/0107 →