IP Library › Granted Patent US 6,555,470
Granted Patent Utility
US 6,555,470 · Confirmation No. 8296

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH METALLIZATION LAYERS INTERCONNECTED BY TUNGSTEN PLUGS

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 Code Description Pages PDF
2002-03-19 TRNA Transmittal of New Application 1 View
2002-03-19 SPEC Specification 5 View
2002-03-19 CLM Claims 1 View
2002-03-19 ABST Abstract 1 View
2002-03-19 DRW Drawings-only black and white line drawings 3 View
2002-03-19 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,555,470
App. No.
10/101,329
Filed
2002-03-19
Granted
2003-04-29
Pub. No.
US20020155651A1
Examiner
DANG, PHUC T
Art Unit
2818
PTA
0 days