Patent Assignment
Reel/Frame 018668/0255
Change of Name
Recorded: 2006-12-22
Received: 2006-12-22
Pages: 21
Assignor
PHILIPS SEMICONDUCTORS VLSI INC.
Executed: 1999-12-20
Assignee
PHILIPS SEMICONDUCTORS INC.
1251 AVENUE OF THE AMERICAS, NEW YORK, NY, 10020, UNITED STATES
Covered Properties
(14)
Method of Using Films Having Optimized Optical Properties for Chemical Mechanical Polishing Endpoint Detection
Application:
10/666,484 →
Derating Factor Determination for Integrated Circuit Logic Design Tools
Application:
10/358,979 →
Smart Retry System That Reduces Wasted Bus Transactions Associated with Master Retries
Application:
10/016,930 →
Semiconductor Processing Methods and Structures for Determining Alignment During Semiconductor Wafer Processing
Application:
10/003,130 →
High Performance Chip/Package Inductor Integration
Application:
09/947,430 →
Semiconductor Device with Transparent Link Area for Silicide Applications and Fabrication Thereof
Application:
09/912,194 →
Method of Illumination Uniformity in Photolithographic Systems
Application:
09/874,607 →
Method and Apparatus for Providing an Embedded Flash-Eeprom Technology
Application:
09/864,615 →
Semiconductor Arrangement Having Capacitive Structure and Manufacture Thereof
Application:
09/850,607 →
Method of Making a Mosfet Structure Having Improved Source/Drain Junction Performance
Application:
09/836,936 →
Set-associative cache-management method with parallel and single-set sequential reads
Application:
09/797,644 →
Semiconductor Blocking Layer for Preventing Uv Radiation Damage to Mos Gate Oxides
Application:
09/795,680 →
Semiconductor Device with High-Temperature-Stable Gate Electrode for Sub-Micron Applications and Fabrication Thereof
Application:
09/783,689 →
Voice Recording and Playback Mode Using the G.726 Half-Rate Within the Personal Handy Phone System
Application:
09/753,824 →