Patent Assignment
Reel/Frame 008836/0720
Assignment of Assignor's Interest
Recorded: 1997-10-03
Pages: 3
Assignor
SOLIS, RAMIRO
Executed: 1997-09-30
Assignee
VLSI TECHNOLOGY, INC.
1109 MCKAY DRIVE, SAN JOSE, CALIFORNIA, 95131
Covered Property
(1)
Method for Forming via Contact Hole in a Semiconductor Device
Patent:
5,925,577 →
Application:
08/943,891 →
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 15, 2006
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 018635/0570 →
Assignment of Assignor's Interest
Dec 15, 2006
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 018645/0779 →
Change of Name
Dec 22, 2006
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 018668/0255 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Termination and Release of Security Interest in Patent Rights
Jan 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 037459/0140 →
Assignment of Assignor's Interest
Mar 15, 2016
From: NXP B.V.
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 037973/0107 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →