Patent Assignment
Reel/Frame 037459/0140
Termination and Release of Security Interest in Patent Rights
Recorded: 2016-01-07
Pages: 11
Assignor
MORGAN STANLEY SENIOR FUNDING, INC.
Executed: 2016-01-05
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, 5656 AG, EINDHOVEN, NETHERLANDS
Covered Properties
(3)
Optimized Structures for Dummy Fill Mask Design
Patent:
5,861,342 →
Application:
08/579,605 →
Method for Dry Etching Sidewall Polymer
Patent:
5,851,302 →
Application:
08/803,180 →
Method for Forming via Contact Hole in a Semiconductor Device
Patent:
5,925,577 →
Application:
08/943,891 →
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 11, 1996
From: GABRIEL, CALVIN T.; WELING, MILIND G.
To: VLSI TECHNOLOGY, INC.
Reel/Frame 007883/0001 →
Assignment of Assignor's Interest
Feb 19, 1997
From: SOLIS, RAMIRO
To: VLSI TECHNOLOGY, INC.
Reel/Frame 008448/0863 →
Assignment of Assignor's Interest
Oct 3, 1997
From: SOLIS, RAMIRO
To: VLSI TECHNOLOGY, INC.
Reel/Frame 008836/0720 →
Change of Name
Dec 15, 2006
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 018635/0570 →
Assignment of Assignor's Interest
Dec 15, 2006
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 018645/0779 →
Change of Name
Dec 22, 2006
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 018668/0255 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Assignment of Assignor's Interest
Mar 15, 2016
From: NXP B.V.
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 037973/0107 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →