Patent Assignment
Reel/Frame 038400/0637
Patent Release
Recorded: 2016-04-11
Pages: 7
Assignors
MORGAN STANLEY SENIOR FUNDING, INC.
Executed: 2016-04-06
MIZUHO BANK, LTD.
Executed: 2016-04-06
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, 5656 AG, EINDHOVEN, NETHERLANDS
Covered Properties
(24)
Shallow Trench Isolation in Floating Gate Devices
Method of Detaching a Thin Semiconductor Circuit from Its Base
Reduction of Sheet Resistance of Phosphorus Implanted Poly-Silicon
Reduction of Cracking in Low-K Spin-on Dielectric Films
Method of Fabricating a Dual Gate Fet
Double Gate Non-Volatile Memory Device and Method of Manufacturing
Finfet-Based Non-Volatile Memory Device
Three-Dimensional Stacked Fin Mos Device with Multiple Gate Regions
Double-Gate Semiconductor Devices Having Gates with Different Work Functions and Methods of Manufacture Thereof
Seimiconductor Devices and Methods of Manufacture Thereof
Method for Improving Inversion Layer Mobility in a Silicon Carbide Mosfet
Resonator
Application:
12/444,684 →
Publication:
US 2010/0090302
Double Patterning for Lithography to Increase Feature Spatial Density
Transistor Device and Method of Manufacturing Such a Transistor Device
Method for Manufacturing an Element Having Electrically Conductive Members for Application in a Microelectronic Package
Nonvolatile Memory Cell Comprising a Nanowire and Manufacturing Method Thereof
Electronic Device Comprising a Convertible Structure
Manufacturing Method for Planar Independent-Gate or Gate-All-Around Transistors
Finfet with Separate Gates and Method for Fabricating a Finfet with Separate Gates
Method for Manufacturing Semiconductor Device and Semiconductor Device
Application:
12/918,398 →
Publication:
US 2011/0018065
Finfet Transistor with High-Voltage Capability and Cmos-Compatible Method for Fabricating the Same
Method of Making Bipolar Transistor
Gate Structure for Field Effect Transistor
Finfet Method and Device
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 3, 2005
From: SCHAIJK, ROBERTUS BAN; VAN DUUREN, MICHIEL
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 017449/0826 →
Assignment of Assignor's Interest
Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Assignment of Assignor's Interest
Mar 25, 2008
From: DOORNBOS, GERBEN; GOARIN, PIERRE
To: NXP B.V.
Reel/Frame 020696/0334 →
Assignment of Assignor's Interest
Mar 27, 2008
From: GOARIN, PIERRE
To: NXP B.V.
Reel/Frame 020711/0231 →
Assignment of Assignor's Interest
Jun 13, 2008
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 021085/0959 →
Assignment of Assignor's Interest
Jun 18, 2008
From: VAN NOORT, WIBO DANIEL; WIDDERSHOVEN, FRANCISCUS PETRUS; SURDEANU, RADU
To: NXP B.V.
Reel/Frame 021115/0729 →
Assignment of Assignor's Interest
Jul 22, 2008
From: NUTTINCK, SEBASTIEN
To: NXP B.V.
Reel/Frame 021270/0451 →
Assignment of Assignor's Interest
Aug 7, 2008
From: VAN DAL, MARK; SURDEANU, RADU
To: NXP, B.V.
Reel/Frame 021356/0060 →
Assignment of Assignor's Interest
Jan 7, 2009
From: SONSKY, JAN; DOORNBOS, GERBEN
To: NXP, B.V.
Reel/Frame 022068/0920 →
Assignment of Assignor's Interest
Mar 2, 2009
From: ROEDLE, THOMAS C.; SVIENBJORNSSON, EINAR O.; ALLERSTAM, CARL F.; OLAFSSON, HALLDOR O.
To: NXP, B.V.
Reel/Frame 022330/0132 →
Assignment of Assignor's Interest
Apr 7, 2009
From: NGUYEN HOANG, VIET; GRAVESTEIJN, DIRK; SURDEANU, RADU
To: NXP, B.V.
Reel/Frame 022516/0729 →
Assignment of Assignor's Interest
Apr 8, 2009
From: GAKIS, ANDREAS; SCHNITT, WOLFGANG
To: NXP B.V.
Reel/Frame 022523/0717 →
Assignment of Assignor's Interest
May 13, 2009
From: VANLEENHOVE, ANJA MONIQUE; VAN STEENWINCKEL, DAVID; VAN DAL, MARK; DOORNBOS, GERBEN
To: NXP, B.V.
Reel/Frame 022681/0121 →
Assignment of Assignor's Interest
Jun 13, 2009
From: NUTTINCK, SEBASTIEN; CURATOLA, GILBERTO
To: NXP, B.V.
Reel/Frame 022822/0346 →
Assignment of Assignor's Interest
Jul 24, 2009
From: EUEN, WOLFGANG; GROSS, STEPHAN
To: NXP, B.V.
Reel/Frame 023004/0796 →
Assignment of Assignor's Interest
Oct 4, 2009
From: WEEKAMP, JOHANNES W.
To: NXP B.V.
Reel/Frame 023323/0247 →
Assignment of Assignor's Interest
Oct 5, 2009
From: TIO CASTRO, DAVID; DELHOUGNE, ROMAIN
To: NXP B.V.
Reel/Frame 023327/0674 →
Assignment of Assignor's Interest
Oct 5, 2009
From: HUERTA, ALMUDENA; VAN DUUREN, MICHIEL JOS; AKIL, NADER; GOLUBOVIC, DUSAN
To: NXP B.V.
Reel/Frame 023326/0159 →
Security Agreement Supplement
Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Assignment of Assignor's Interest
Mar 15, 2016
From: NXP B.V.
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 037973/0107 →
Certificate Re. Termination and Release of Security Interest in Patent Rights
Apr 11, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.; MIZUHO BANK, LTD.
To: NXP B.V.
Reel/Frame 038401/0296 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release
Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →