Patent Assignment
Reel/Frame 016975/0352
Assignment of Assignor's Interest
Recorded: 2005-09-09
Pages: 4
Assignors
KIM, JAE-HAK
Executed: 2005-08-19
LEE, SUN-JUN
Executed: 2005-08-12
LEE, SEUNG-JIN
Executed: 2005-08-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, KYUNGKI-DO, SUWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Methods for Forming Dual Damascene Wiring for Semiconductor Devices Using Protective via Capping Layer