Patent Assignment
Reel/Frame 016981/0057
Assignment of Assignor's Interest
Recorded: 2005-09-14
Pages: 3
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO 151-8543, JAPAN
Covered Property
(1)
Semiconductor Device Packaged into Chip Size and Manufacturing Method Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Ownership by Corporate Separation
Jan 3, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027465/0812 →
Change of Ownership by Corporate Separation-to Correct Assignee's Address on Reel 027465, Frame 0812
Jan 6, 2012
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027492/0449 →