IP Library Assignment 016991/0477
Patent Assignment
Reel/Frame 016991/0477

Assignment of Assignor's Interest

Recorded: 2005-09-09 Pages: 3
Assignor
ONG, ADRIAN E.
Executed: 2005-09-08
Assignee
INAPAC TECHNOLOGY, INC.
2290 NORTH FIRST STREET, SUITE 201, SAN JOSE, CALIFORNIA, 95131
Covered Property (1)
Shared Bond Pad for Testing a Memory Within a Packaged Semiconductor Device
Patent: 7,245,141 →
Application: 11/223,286 →
Publication: US 2006/0152241
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Ucc Financing Statement Filed in California Aug 15, 2008
From: INAPAC TECHNOLOGY, INC.
To: CARR & FERRELL LLP
Reel/Frame 021425/0952 →
Release of Security Agreement (Ca) Jan 22, 2009
From: CARR & FERRELL LLP
To: INAPAC TECHNOLOGY, INC.
Reel/Frame 022158/0338 →
Assignment of Assignor's Interest Apr 28, 2009
From: INAPAC TECHNOLOGY, INC.
To: RAMBUS INC.
Reel/Frame 022597/0896 →