Patent Assignment
Reel/Frame 016995/0612
Assignment of Assignor's Interest
Recorded: 2006-01-10
Received: 2006-01-10
Pages: 10
Assignors
PATRON, DAVID
Executed: 2005-09-08
MARSHALL, VERNON
Executed: 2005-09-12
TOLLEY, DAVID W.
Executed: 2005-09-13
JIN, KEYE
Executed: 2005-09-22
Assignee
AMERICAN EXPRESS MARKETING & DEVELOPMENT CORP.
200 VESEY STREET, NEW YORK, NY, 10285-4900, UNITED STATES
Covered Properties
(4)
Chip Scale Package Having Flip Chip Interconnect on Die Paddle
Application:
11/280,971 →
Semiconductor Package Having Double Layer Leadframe
Application:
11/274,925 →
Wire Bond Interconnection
Application:
11/273,635 →
System, method, and computer program product for searching credit agencies using partial identification numbers
Application:
11/236,822 →