IP Library › Assignment 016997/0069
Patent Assignment
Reel/Frame 016997/0069

Assignment of Assignor's Interest

Recorded: 2005-11-09 Pages: 2
Assignor
JEONG, IN KWON
Executed: 2005-09-06
Assignee
INOPLA INC.
10697 ROSEWOOD RD., UNIT D, CUPERTINO, CALIFORNIA, 95014
Covered Property (1)
Apparatus and Method for Polishing Semiconductor Wafers Using Pivotable Load/Unload Cups
Patent: 7,367,866 →
Application: 11/208,158 →
Publication: US 2006/0046617
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2009
From: INOPLA INC.
To: KOMICO TECHNOLOGY, INC.
Reel/Frame 022917/0246 →
Assignment of Assignor's Interest Sep 29, 2009
From: KOMICO TECHNOLOGY, INC.
To: NARA BANK
Reel/Frame 023312/0842 →
Assignment of Assignor's Interest Feb 5, 2014
From: BBCN BANK FKA NARA BANK
To: KOMICO TECHNOLOGY, INC.
Reel/Frame 032144/0625 →
Assignment of Assignor's Interest Feb 5, 2014
From: KOMICO TECHNOLOGY, INC.
To: HAM, THOMAS H.
Reel/Frame 032144/0710 →